W2395 is a one-component dual-cure resin with blocked isocyanate, which can be cured by UV and moisture. It has excellent adhesion, weather resistance, salt spray resistance, thermal shock resistance on PCB (printed circuit boards), and can be applied as sealing protective layer on circuit board of electronic product.

W2396 is a one-component dual-cure resin with blocked isocyanate, which can be cured by UV and moisture. It has excellent adhesion, weather resistance, salt spray resistance, thermal shock resistance on PCB (printed circuit boards), and can be applied as sealing protective layer on circuit board of electronic product.